• Set includes one handle and 10 blades 
  

• Can be used for remove IC Chip CPU BGA on smart phone mainboard, PCB repair, etc.

• With the scale on blades design, convenient to use

Specification:

• TS016 handle, 139.7x11.4mm

• MCN-A blade, remove phone IC/CPU/Baseband, 33x6mm

• MCN-B blade, shovel glue/bonding pad, 34x6mm

• MCN-C blade, CPU/shovel glue/bonding pad, 29x6mm

• MCN-D blade, CPU/shovel glue/bonding pad, 26x6mm

• MCN-E blade, shovel glue, 34x6mm

• MCN-F blade, remove glue on marginal place (IC), 24.5x6mm

• MCN-G blade, remove IC on motherboard, 28x6mm

• MCN-H blade, remove IC, 29x6mm

• MCN-I blade, remove 6S power IC, 22x6mm

• MCN-J blade, remove glue on marginal place (IC), 27.5x6mm