Set includes one handle and 10 blades
Can be used for remove IC Chip CPU BGA on smart phone mainboard, PCB repair, etc.
With the scale on blades design, convenient to use
Specification:
TS016 handle, 139.7x11.4mm
MCN-A blade, remove phone IC/CPU/Baseband, 33x6mm
MCN-B blade, shovel glue/bonding pad, 34x6mm
MCN-C blade, CPU/shovel glue/bonding pad, 29x6mm
MCN-D blade, CPU/shovel glue/bonding pad, 26x6mm
MCN-E blade, shovel glue, 34x6mm
MCN-F blade, remove glue on marginal place (IC), 24.5x6mm
MCN-G blade, remove IC on motherboard, 28x6mm
MCN-H blade, remove IC, 29x6mm
MCN-I blade, remove 6S power IC, 22x6mm
MCN-J blade, remove glue on marginal place (IC), 27.5x6mm